In January 2026, the Institute of Physics, Chinese Academy of Sciences (IOP-CAS), released a landmark document—The 2025 Strategic Research Report on REBCO High-Temperature Superconducting Tapes. This is the world’s first strategic report dedicated specifically to the development of high-temperature superconducting tapes, and it systematically identifies the “ten key scientific and technological challenges” currently hindering the large-scale application of REBCO tapes.
This report holds significant strategic guidance for upstream enterprises in the supply chain, such as Ningbo Yongcheng Metal Materials Technology Co., Ltd. It notes that although REBCO high-temperature superconducting tapes have entered the early commercialization phase, their overall performance still has substantial room for improvement. As a multilayer composite structure—comprising a metallic substrate, buffer layers, a superconducting layer, and a protective coating—the performance bottleneck of each individual layer, as well as interfacial compatibility issues between layers, constitute the core constraints on further advancement.
At the substrate level, the report poses a critical question: “How can we significantly enhance the yield strength and fatigue resistance of alloy substrates to meet the demands of high-field applications?” Currently, commercial Hastelloy-based substrates exhibit a yield strength of approximately 650 MPa at 77 K. However, for next-generation ultra-high-field magnets exceeding 40 tesla, this mechanical performance is insufficient. The immense electromagnetic forces generated in such high-field environments require substrates with yield strengths above 1,200 MPa (at 77 K) and excellent resistance to cyclic loading. Yet, existing materials are approaching their intrinsic performance limits.
This clearly defined challenge provides a focused R&D direction for materials companies like Yongcheng Metal. To meet the requirements of next-generation high-field superconducting magnets, breakthroughs in alloy composition design are essential. In a joint patent filed with Anhui University of Technology (Publication No. CN118398273A), Yongcheng Metal explores the addition of elements such as vanadium (V), cobalt (Co), and tungsten (W) into Hastelloy, while optimizing the ratios of chromium (Cr), molybdenum (Mo), and iron (Fe), aiming to enhance the material’s comprehensive mechanical properties. This effort represents a proactive response to a shared industry-wide challenge.
The report also highlights interfacial issues between the buffer and superconducting layers. Since buffer layers are typically electrical insulators, their low thermal conductivity impedes rapid heat dissipation from the superconducting layer, thereby compromising tape stability. Additionally, maintaining the crystalline texture (texture stability) of the buffer layer at ultra-thin thicknesses remains a major hurdle in industrial-scale production.
Although Yongcheng Metal does not directly manufacture buffer or superconducting layers, the surface quality and dimensional precision of its substrates critically influence the stability of downstream processes such as IBAD (Ion Beam Assisted Deposition). Excessive thickness tolerance or microscopic surface defects on the substrate can degrade buffer layer texture, leading to performance non-uniformity across kilometer-length tapes.
By interpreting this report, it becomes clear that the industrialization of high-temperature superconductors demands collaborative innovation across the entire value chain. Substrate manufacturers must work closely with superconductor producers to co-develop customized substrates—featuring higher strength, superior surface quality, and enhanced thermal stability—tailored to specific applications such as fusion energy and power transmission. This is not only a technical challenge but also an essential step toward the maturity of China’s superconducting industry.
